Breaking News

The Prowess News

latest stock market news

Solder Ball Market 2019 Research report contains a qualified and in-depth examination of Solder Ball Market. At first, the report provides the current Solder Ball business situation along with a valid assessment of the Solder Ball business. Solder Ball report is partitioned based on driving Solder Ball players, application and regions. The progressing Solder Ball economic situations are additionally discovered in the report.

Short Description About Solder Ball Market :

In integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as “ball” or “bumps”) is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules. The Solder Ball can be placed manually or by automated equipment, and are held in place with a tacky flux. Solder Ball are very small spheres of high-purity solder for micro soldering system. The most important advantages of Solder Ball are their very clean surfaces and exact solder quantity control. Most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.

Get Sample PDF of reporthttps://www.360researchreports.com/enquiry/request-sample/13949979

The research covers the current market size of the Solder Ball market and its growth rates based on 5-year records with company outline ofKey players/manufacturers:

  • Senju Metal
  • DS HiMetal
  • MKE
  • YCTC
  • Nippon Micrometal
  • Accurus
  • PMTC
  • Shanghai hiking solder material
  • Shenmao Technology

Scope Of The Report :

Asia Pacific held the leading share of the market in terms of revenue in 2016. We estimate that the global market share of Solder Ball is 27.66% in Taiwan, 20.54% in Korea, 17.28% in Japan, 15% in China and 10.56% in South East Asia. Because there are many larger IC packaging (including testing) companies in these region, such as ASE, Amkor, SPIL etc. Solder Ball are most suitable for Ball Grid Array, Multi-Chip Module, Chip On board Flip Chip and CSP.Senju Metal, DS HiMetal and MKE captured the top three revenue share spots in the Solder Ball market in 2016. Senju Metal dominated with 40.00% revenue share, followed by DS HiMetal with 19.14% revenue share and MKE with 7.08% revenue share.The worldwide market for Solder Ball is expected to grow at a CAGR of roughly 6.6% over the next five years, will reach 310 million US$ in 2024, from 210 million US$ in 2019, according to a new research study.This report focuses on the Solder Ball in global market, especially in North America, Europe and Asia-Pacific, South America, Middle East and Africa. This report categorizes the market based on manufacturers, regions, type and application.

Inquire more and share questions if any before the purchase on this report at –https://www.360researchreports.com/enquiry/pre-order-enquiry/13949979

Report further studies the Solder Ball market development status and future trend across the world. Also, it splits Solder Ball market by Type and by Applications to fully and deeply research and reveal market profile and prospects.

Major Classifications are as follows:

  • Lead Solder Ball
  • Lead Free Solder Ball

Major Applications are as follows:

  • BGA
  • CSP and WLCSP
  • Flip-Chip and Others

Geographically, this report is segmented into several key regions, with sales, revenue, market share and growth Rate of Solder Ball in these regions, from 2014 to 2024, covering

  • North America (United States, Canada and Mexico)
  • Europe (Germany, UK, France, Italy, Russia and Turkey etc.)
  • Asia-Pacific (China, Japan, Korea, India, Australia, Indonesia, Thailand, Philippines, Malaysia and Vietnam)
  • South America (Brazil, Argentina, Columbia etc.)
  • Middle East and Africa (Saudi Arabia, UAE, Egypt, Nigeria and South Africa)

The Solder Ball market report provides answers to the following key questions:

  • What will be the Solder Ball market size and the growth rate in 2024?
  • What are the main key factors driving the global Solder Ball market?
  • What are the key market trends impacting the growth of the global Solder Ball market?
  • Which Trending factors influencing the market shares of the top regions across the globe?
  • Who are the key market players and what are their strategies in the global Solder Ball market?
  • What are sales, revenue, and price analysis by regions of Solder Ball?
  • What are the market opportunities and threats faced by the vendors in the global Solder Ball market?
  • What industrial trends, drivers and challenges are manipulating its growth?
  • What are the key outcomes of the five forces analysis of the global Solder Ball market?

Purchase this report (Price 3480 USD for a single-user license) –https://www.360researchreports.com/purchase/13949979

Major Points from Table of Contents:

1 Market Overview
1.1 Solder Ball Introduction
1.2 Market Analysis by Type
1.3 Market Analysis by Applications
1.4 Market Dynamics
1.4.1 Market Opportunities
1.4.2 Market Risk
1.4.3 Market Driving Force

2.Manufacturers Profiles

2.4.1 Business Overview
2.4.2 Solder Ball Type and Applications
2.4.2.1 Product A
2.4.2.2 Product B

3.Global Solder Ball Sales, Revenue, Market Share and Competition by Manufacturer (2017-2018)

3.1 Global Solder Ball Sales and Market Share by Manufacturer (2017-2018)
3.2 Global Solder Ball Revenue and Market Share by Manufacturer (2017-2018)
3.3 Market Concentration Rate
3.3.1 Top 3 Solder Ball Manufacturer Market Share in 2018
3.3.2 Top 6 Solder Ball Manufacturer Market Share in 2018
3.4 Market Competition Trend

4 Global Solder Ball Market Analysis by Regions

4.1 Global Solder Ball Sales, Revenue and Market Share by Regions
4.1.1 Global Solder Ball Sales and Market Share by Regions (2014-2019)
4.1.2 Global Solder Ball Revenue and Market Share by Regions (2014-2019)
4.2 North America Solder Ball Sales and Growth Rate (2014-2019)
4.3 Europe Solder Ball Sales and Growth Rate (2014-2019)
4.4 Asia-Pacific Solder Ball Sales and Growth Rate (2014-2019)
4.6 South America Solder Ball Sales and Growth Rate (2014-2019)
4.6 Middle East and Africa Solder Ball Sales and Growth Rate (2014-2019)

6 Solder Ball Market Forecast (2019-2024)
6.1 Global Solder Ball Sales, Revenue and Growth Rate (2019-2024)
6.2 Solder Ball Market Forecast by Regions (2019-2024)
6.3 Solder Ball Market Forecast by Type (2019-2024)
6.3.1 Global Solder Ball Sales Forecast by Type (2019-2024)
6.3.2 Global Solder Ball Market Share Forecast by Type (2019-2024)
6.4 Solder Ball Market Forecast by Application (2019-2024)
6.4.1 Global Solder Ball Sales Forecast by Application (2019-2024)
6.4.2 Global Solder Ball Market Share Forecast by Application (2019-2024)

6.Sales Channel, Distributors, Traders and Dealers
6.1 Sales Channel
6.1.1 Direct Marketing
6.1.2 Indirect Marketing
6.1.3 Marketing Channel Future Trend
6.2 Distributors, Traders and Dealers

7. Research Findings and Conclusion

8. Appendix
8.1 Methodology
8.2 Data Source

Continued…..

About Us:

360 Research Reports is the credible source for gaining the market reports that will provide you with the lead your business needs. At 360 Research Reports, our objective is providing a platform for many top-notch market research firms worldwide to publish their research reports, as well as helping the decision makers in finding most suitable market research solutions under one roof. Our aim is to provide the best solution that matches the exact customer requirements. This drives us to provide you with custom or syndicated research reports.

Contact Us:
Name: Mr. Ajay More
Email: [email protected]
Organization: 360 Research Reports
Phone: +44 20 3239 8187/ +14242530807

Press Release Distributed by The Express Wire

To view the original version on The Express Wire visit Solder Ball Market 2019 to 2024 With Top Countries Data : Opportunities, Industry Trends and Policies by Regions and Companies